ISSN No:2250-3676 ----- Crossref DOI Prefix: 10.64771 ----- Impact Factor: 9.625
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    AI-Driven Emotional Detection For Stress Monitoring In IT Professionals

    1Ch. V. Prudhvila,2H. Manasa,3B. Pujitha,4B. Akhila,5SK. Heena

    Author

    ID: 3705

    DOI:

    Abstract :

    The Issue Of Stress Among IT Professionals Has Emerged As A Significant Problem Due To Extended Working Hours, Strict Deadlines, And Constant Exposure To High-pressure Situations. Ongoing Stress Can Result In Mental Health Challenges, Decreased Productivity, And Burnout. This Study Introduces An AI-powered Emotional Analysis System Aimed At Evaluating And Tracking Stress Levels In IT Professionals. The Suggested System Employs Machine Learning Methods To Recognize Emotional States Based On User-submitted Data, Such As Text Entries And Behavior Patterns. By Detecting Stress Signals Early On, The System Aids Both Individuals And Organizations In Implementing Preventive Measures. The Execution Of This System Shows Enhanced Accuracy, Diminished Manual Workload, And Efficient Stress Monitoring. This Approach Offers A Scalable And Smart Solution To Fostering Mental Health In The IT Industry. Keywords: Artificial Intelligence, Emotional Analysis, Stress Monitoring, Facial Expression Recognition, Machine Learning, Deep Learning, Computer Vision, Emotion Detection, Image Processing, OpenCV, Convolutional Neural Networks (CNN), Real-Time Emotion Analysis, Workplace Mental Health, IT Professionals Stress Analysis.

    Published:

    31-7-2026

    Issue:

    Vol. 26 No. 7 (2026)


    Page Nos:

    1492 - 1497


    Section:

    Articles

    License:

    This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

    How to Cite

    1Ch. V. Prudhvila,2H. Manasa,3B. Pujitha,4B. Akhila,5SK. Heena, AI-Driven Emotional detection for Stress Monitoring in IT Professionals , 2026, International Journal of Engineering Sciences and Advanced Technology, 26(7), Page 1492 - 1497, ISSN No: 2250-3676.

    DOI: