Abstract :

The Continuous Miniaturization Of Electronic Devices And The Rapid Increase In Computational Power Have Significantly Intensified Heat Generation In Modern Electronic Systems. High-performance Processors, Power Electronic Modules, Data Centers, Electric Vehicles, Aerospace Electronics, And Advanced Communication Equipment Require Efficient Thermal Management Solutions To Maintain Device Reliability, Operational Stability, And Extended Service Life. Conventional Air-cooled Heat Sinks Are Increasingly Unable To Dissipate The High Heat Flux Generated By Compact Electronic Components Due To Their Limited Heat Transfer Capability And Relatively High Thermal Resistance. Consequently, Advanced Liquid Cooling Technologies, Particularly Microchannel Heat Sinks, Have Emerged As Promising Thermal Management Solutions Because Of Their High Surface-area-to-volume Ratio, Compact Size, And Superior Heat Removal Performance. However, Conventional Straight Microchannel Heat Sinks Often Experience Flow Maldistribution, Increased Pressure Drop, Localized Hot Spots, And Limited Cooling Uniformity, Thereby Restricting Their Effectiveness Under High Heat Flux Operating Conditions. This Research Presents An Experimental Investigation Of Hybrid Microchannel Heat Sink Designs For Enhanced Thermal Management In Compact Electronic Systems, Focusing On Improving Thermal Performance Through Optimized Hybrid Microchannel Geometries. The Proposed Heat Sink Integrates Straight Microchannels, Wavy Channels, Pin-fin Structures, And Secondary Flow Enhancement Features To Improve Coolant Mixing, Increase Convective Heat Transfer, And Reduce Thermal Resistance. Experiments Are Conducted Using Deionized Water As The Working Fluid Under Varying Coolant Flow Rates And Heat Loads Representative Of Compact Electronic Devices. Temperature Distribution, Pressure Drop, Thermal Resistance, Heat Transfer Coefficient, Nusselt Number, And Cooling Efficiency Are Experimentally Evaluated To Determine The Effectiveness Of The Proposed Hybrid Configuration. Experimental Results Demonstrate That The Hybrid Microchannel Heat Sink Significantly Improves Heat Transfer Performance While Maintaining Acceptable Hydraulic Characteristics. Compared With Conventional Straight Microchannel Designs, The Proposed Configuration Achieves Lower Maximum Surface Temperature, Enhanced Temperature Uniformity, Reduced Thermal Resistance, Higher Heat Transfer Coefficient, And Improved Overall Cooling Efficiency. The Optimized Design Effectively Dissipates High Heat Flux While Maintaining Moderate Pressure Losses, Making It Suitable For Next-generation Electronic Cooling Systems. The Proposed Hybrid Microchannel Heat Sink Offers An Efficient And Reliable Thermal Management Solution For Microprocessors, Power Electronics, Electric Vehicle Control Units, High-performance Computing Platforms, Medical Electronics, Aerospace Systems, And Advanced Embedded Electronic Devices.

Published:

23-10-2024

Issue:

Vol. 24 No. 10 (2024)

Page Nos:

486-499

Section:

Articles

License:

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

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