Abstract :

Advanced Semiconductor Packaging Has Become A Critical Enabler For Next-generation Electronic Systems As Traditional Transistor Scaling Approaches Physical And Economic Limits. Modern Packaging Technologies Such As 2.5D Integration, 3D Stacking, Chiplet Architectures, Fan-out Wafer-level Packaging, And System-inpackage (SiP) Solutions Provide Improved Performance, Reduced Power Consumption, And Higher Integration Density. This Paper Presents A Comprehensive Study Of Advanced Packaging Techniques, Including Architectural Designs, Materials, Manufacturing Processes, And Performance Evaluation Metrics. A Detailed Literature Review Summarizes Recent Technological Developments And Industry Practices. Limitations Such As Thermal Management, Cost, Yield Challenges, And Reliability Concerns Are Analyzed. Sample Results Demonstrate Performance Improvements Compared With Conventional Packaging Approaches. The Study Concludes That Advanced Packaging Is A Key Driver Of Future Semiconductor Innovation And Will Play A Crucial Role In Enabling High-performance Computing, Artificial Intelligence, And Next-generation Communication Systems.

Published:

21-2-2026

Issue:

Vol. 26 No. 2 (2026)

Page Nos:

144-146

Section:

Articles

License:

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

How to Cite